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#advanced-packaging

2 stories · “advanced-packaging”.

The Minato Mirai waterfront district of Yokohama, where Samsung's Advanced Package Lab opened on September 8

Sep 15, 2026

Samsung Opens a Yokohama Packaging Lab to Close Its HBM Gap

Samsung has opened an advanced semiconductor packaging research hub in Yokohama, betting that Japanese materials and toolmakers hold the key to its AI memory ambitions.

By TPW Editorial7 min read

Infrared photo of a delidded AMD EPYC processor showing a large central I/O die surrounded by eight smaller CPU chiplets on a package substrate

Aug 4, 2026

Advanced Packaging: The New Battleground of the Semiconductor Industry

Smaller transistors no longer deliver big enough gains. How advanced packaging, chiplets, 2.5D/3D stacking, HBM, became the chip industry's battleground.

By TPW Editorial11 min read