6 stories · “hbm”.
Micron reported record fiscal Q4 2026 revenue of $54.23 billion, up nearly fivefold from a year earlier, as AI demand for DRAM and HBM lifted margins.
Meta will deploy its MTIA 450 inference chip, designed with Broadcom and built by TSMC, in data centers in the first half of 2027, as it scales custom silicon.
SK Hynix is in exploratory talks with Intel about producing memory chips on US soil for the first time, with Intel's delayed Ohio complex as one option.
Samsung has opened an advanced semiconductor packaging research hub in Yokohama, betting that Japanese materials and toolmakers hold the key to its AI memory ambitions.
Huawei has lifted its Ascend 950DT above 250,000 yuan and Cambricon is repricing its next chip, as a high-bandwidth memory crunch reshapes China's AI buildout.
Smaller transistors no longer deliver big enough gains. How advanced packaging, chiplets, 2.5D/3D stacking, HBM, became the chip industry's battleground.
