Intel's Data Center Revenue Rose 78% and the Stock Fell 28.58%
Intel beat its own Q3 guidance as data center revenue rose 78%, then guided Q4 about 9% below consensus. Its shares fell 28.58% in one of their worst sessions.
By TPW Editorial8 min read
#semiconductors
25 stories · “semiconductors”.
Samsung's Profit Topped 100 Trillion Won for the First Time on AI Memory
Samsung's Q3 operating profit hit KRW 107.4 trillion, the first above KRW 100 trillion for a tech company, as memory earned 99% and devices lost money.
By TPW Editorial8 min read
SK Hynix Posts a Record 104.6 Trillion Won Quarter as HBM4 Ramps
SK Hynix posted record third-quarter 2026 revenue of 104.62 trillion won and an 80% operating margin, with HBM4 set to outsell HBM3E in the fourth quarter.
By TPW Editorial9 min read
TSMC Posts a Sixth Straight Record Quarter as AI Demand Outruns Supply
TSMC's Q3 2026 net income hit a record NT$763 billion on 15 October, up 68.7% year on year, as AI demand beat its own guidance and chip stocks fell anyway.
By TPW Editorial7 min read
AI Debt Fears Trigger a Global Tech Selloff
CoreWeave shares and bonds slid on 16 October 2026 as AI debt fears drove a global tech selloff, with the Nasdaq down 2.14% and its worst week since July.
By TPW Editorial8 min read
Taiwan Plans to Make Unauthorised AI-Chip Exports to China a Crime
Taiwan plans to add AI servers and cutting-edge chips to its export-control list, making unauthorised shipments to China a crime under the Foreign Trade Act.
By TPW Editorial8 min read
Micron's Revenue Nearly Quintuples to a Record $54.23 Billion on AI Memory Demand
Micron reported record fiscal Q4 2026 revenue of $54.23 billion, up nearly fivefold from a year earlier, as AI demand for DRAM and HBM lifted margins.
By TPW Editorial9 min read
Eight Tech Companies Are Evaluating Intel's 14A Node, and None Has Signed
A Piper Sandler research note says Amazon, Apple, AMD, Google, Tesla, Microsoft, Nvidia and Qualcomm are evaluating Intel's 14A process, with no commitments.
By TPW Editorial10 min read
Intel Can Fill Only About Half of CPU Demand as AI Inference Strains Its Fabs
Intel CEO Lip-Bu Tan says the chipmaker fills only about half of CPU demand as AI inference strains its fabs, and the 14A production timeline is in dispute.
By TPW Editorial8 min read
Samsung Starts Trial Production of Tesla's AI5 Chip at Its Texas 2nm Fab
Samsung has begun 2nm trial runs for Tesla's next-generation AI5 processor at its Taylor, Texas fab, pulling production forward as TSMC capacity stays tight.
By TPW Editorial7 min read
Huawei Pulls Ascend 960DT to Q1 2027 and Unveils a Near-Packaged-Optics SuperPoD
Huawei pulled the Ascend 960DT to Q1 2027, showed the industry-first NPO Atlas 960E SuperPoD at Connect 2026 and set a yearly doubling cadence in Shanghai.
By TPW Editorial8 min read
SK Hynix Weighs Making Memory in the US by Leasing Intel's Ohio Site
SK Hynix is in exploratory talks with Intel about producing memory chips on US soil for the first time, with Intel's delayed Ohio complex as one option.
By TPW Editorial8 min read
Samsung Opens a Yokohama Packaging Lab to Close Its HBM Gap
Samsung has opened an advanced semiconductor packaging research hub in Yokohama, betting that Japanese materials and toolmakers hold the key to its AI memory ambitions.
By TPW Editorial7 min read
TSMC to Lift 2nm and 3nm Output as AI Demand Outruns Supply
TSMC is raising advanced-node capacity sharply, targeting a roughly 70% increase in 3nm wafer output over 18 months as AI chip demand outstrips supply.
By TPW Editorial7 min read
The Week in Tech: The AI Boom Meets Its Limits
A record Patch Tuesday, GPT-6 Astra and public safety warnings, Microsoft's 38-gigawatt plan, Intel's High-NA lead, and a Senate AI duty of care from the week ending Sept. 13, 2026.
By TPW Editorial20 min read
Intel Has Run a Million High-NA Wafers, and Its Rivals Just Adopted Its Standard
Intel says it has processed more than a million High-NA EUV wafers, roughly three-quarters of the world total, as TSMC and Samsung sign on to the mask standard it championed.
By TPW Editorial8 min read
Qualcomm Pays Amazon in Stock for a Place in the AI Data Centre
Amazon gets warrants worth about $4 billion as Qualcomm buys its way into AWS AI infrastructure, with a vesting ceiling of $60 billion in purchases.
By TPW Editorial8 min read
China's AI Chipmakers Are Raising Prices as the HBM Shortage Bites
Huawei has lifted its Ascend 950DT above 250,000 yuan and Cambricon is repricing its next chip, as a high-bandwidth memory crunch reshapes China's AI buildout.
By TPW Editorial3 min read
TSMC's August Revenue Hits a Record NT$514.8 Billion as AI Demand Outruns Supply
TSMC's August 2026 revenue hit a record NT$514.8 billion, up 53.3% year on year, as AI demand keeps outrunning its expanding fab and packaging capacity.
By TPW Editorial9 min read
DOJ Probes Whether Nvidia's Groq Deal Was Built to Avoid Antitrust Review
The Justice Department is probing whether Nvidia's $17 billion Groq licensing and hiring deal was built to avoid antitrust review, the New York Times reports.
By TPW Editorial9 min read
Broadcom Raises Its AI Chip Forecast to $115 Billion, and $230 Billion by 2028
Broadcom's custom AI chip business tripled to $16.7 billion last quarter as the company raised its two-year outlook, even as next-quarter guidance landed just below Wall Street's bar.
By TPW Editorial9 min read
TSMC's A16 Is Ready: Backside Power Meets the Angstrom Era
TSMC has completed development of its 1.6nm-class A16 process with Super Power Rail, targeting Q4 mass production for AI and HPC customers.
By TPW Editorial9 min read
EUV Lithography, Explained: How the Chip Industry Prints at 13.5 Nanometers
Extreme ultraviolet lithography uses 13.5 nm light from tin plasma to print the smallest chip layers. How EUV works, what it costs, and why ASML controls it.
By TPW Editorial11 min read
Samsung's HBM4 Just Hit 'Golden Yield': Four Months Early
Samsung's HBM4 yield has reportedly reached 80%, the industry's 'golden yield' threshold, unlocking volume supply for major Nvidia and AMD accelerators.
By TPW Editorial8 min read
Advanced Packaging: The New Battleground of the Semiconductor Industry
Smaller transistors no longer deliver big enough gains. How advanced packaging, chiplets, 2.5D/3D stacking, HBM, became the chip industry's battleground.
By TPW Editorial11 min read